金屬聚合-金剛石砂紙：用于較難磨的材料，如陶瓷、復合材料、硬質合金和金屬復合材料
樹脂聚合-金剛石砂紙：適合于多種材料，包括較硬金屬和非金屬涂層
這兩種既可用于帶背膠的標準研磨盤，也可用于支持磁性系統的磁性研磨盤。
樹脂聚合-剛硬金剛石砂紙：用于粗糙/平面的韌性材料研磨。金剛石網格面積大且厚，提供更高的耐磨性，從而延長了產品的使用壽命。在金剛石網格之間距離較寬，允許水來快速沖洗碎屑、有效地幫助縮短研磨時間，減少使用量，并產生優異的樣品平整度。用于硬質合金，陶瓷，堅硬的合金（維氏硬度大于150 ），和光學玻璃等材料的粗磨，特點包括：
1. 金相封裝試樣的平滑性和邊緣保持
2. 的材料研磨力
3. 的產品壽命，降低整體成本
只支持磁性盤，砂紙背面有高抓力涂層，可防止樣品在高轉動下位移，厚的、剛性的不銹鋼片可粘附在任何的磁性盤上。
Metal Plated
Metal plated discs are recommended for materials including
ceramics, carbides and metal matrix composites. Adhesive
back discs are also available. To order, remove 'M' from the
item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 260 µm | 50-50000M | 50-50100M | 50-51000M |
| 125 µm | 50-50005M | 50-50105M | 50-51005M |
| 70 µm | 50-50010M | 50-50110M | 50-51010M |
| 30 µm | 50-50015M | 50-50115M | 50-51015M |
| 15 µm | 50-50025M | 50-50125M | 50-51025M |
| 9 µm | 50-50035M | 50-50135M | 50-51035M |
| 6 µm | 50-50040M | 50-50140M | 50-51040M |
Resin Bond
Resin bond discs are recommended for a wide variety of
materials including hard metals and nonmetal coatings.
Adhesive back discs are also available. To order, remove 'M'
from the item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 80 Grit | 50-80800M | 50-81000M | 50-81200M |
| 120 Grit | 50-80805M | 50-81005M | 50-81205M |
| 220 Grit | 50-80810M | 50-81010M | 50-81210M |
| 40 µm | 50-80820M | 50-81020M | 50-81220M |
| 25 µm | 50-80825M | 50-81025M | 50-81225M |
| 9 µm | 50-80830M | 50-81030M | 50-81230M |
Resin Bond RIGID
Resin bond RIGID discs are designed for aggressive removal
of materials such as sintered carbide, ceramic, hard metals and
optical glass. They provide excellent flatness and durability.
Adhesive back discs are also available. To order, remove 'M'
from the item number.
| Grade | 8" (200 mm) | 10" (250 mm) | 12" (300 mm) |
| 120 Grit | 50-70805M | 50-71005M | 50-71205M |
| 220 Grit | 50-70810M | 50-71010M | 50-71210M |
| 600 (P-1200) Grit | 50-70820M | 50-71020M | 50-71220M |
